Low Face Velocity Dry Cooling Coil (Low Face Velocity DCC)

Main application: Cleanroom MAU recirculation air, data center aisle containment cooling, low-turbulence precision temperature control workshop.

Standard Velocity Classification

• Normal dry coil face velocity: 1.2 ~ 2.0 m/s

• Low face velocity dry coil: 0.6 ~ 1.1 m/s (core design range)

• Avoid below 0.6 m/s: risk of airflow maldistribution & uneven heat exchange

Working principle unchanged from standard dry coil:

Chilled water supply temperature controlled 1~2K higher than air dew point, coil surface always above dew point → sensible heat only, zero condensation.

Latent load & humidity fully handled by MAU fresh air unit.

Core Technical Characteristics (Low Face Velocity Design)

Air Side

Larger coil frontal area for same airflow

Ultra-low air pressure drop: typically 25 ~ 70 Pa

Uniform airflow distribution across fin surface; eliminate local cold spot & partial dew risk

Lower air turbulence; ideal for laminar flow cleanroom

Water Side

Recommended water velocity: 0.8 ~ 1.6 m/s

Counter-flow arrangement adopted to compensate mild reduction of heat transfer coefficient under low air speed

Standard chilled water: 16℃ IN / 21℃ OUT (cleanroom); 13℃ IN /18℃ OUT (data center containment)

Structure Optimization for Low Face Velocity DCC

Wide fin pitch: 3.2 ~ 4.2 FPI, reduce dust accumulation

Optional: full SUS304 / SUS316 tube-fin (corrosive cleanroom) or copper tube + epoxy coated aluminum fin

2 / 3 rows tube layout mainstream; rarely use 4 rows unless high sensible load

Hydraulic tube expansion for tight tube-fin contact

Equipped with stainless steel air vent & drain valve; optional emergency SS drain pan

Key Advantages of Low Face Velocity Dry Coil

Minimum condensation risk (Most Critical Merit)

Lower air velocity reduces air-side heat transfer intensity; smaller temperature drop of air passing coil. Avoid local coil surface temperature dipping below dew point under transient working conditions (load fluctuation, chilled water temperature drift).

Ultra-low fan energy consumption

Low air resistance reduces AHU / ceiling circulation fan static pressure requirement, cut long-term running power consumption.

Stable & uniform indoor temperature

Gentle air temperature change after coil; no over-cooling airflow. Achieve ±0.1~±0.3℃ precise temperature control for semiconductor, biopharma cleanroom.

Less particle re-entrainment

Low airflow shear force on coil fin surface; reduce dust blowing back into clean air, benefit ISO5~ISO7 clean grade maintenance.

Long service life & easy maintenance

Lower airflow erosion on fins; longer cleaning cycle. Compressed-air offline cleaning works efficiently.

Application Scenarios

Semiconductor / wafer fab ISO5~ISO7 cleanroom MAU recirculation dry coil

Biopharma GMP workshop, sterile medical device production line

Data center hot/cold aisle containment ceiling suspended dry coil (AI high-density server room)

Precision laboratory, metrology room requiring ultra-stable temperature & low turbulence

Food aseptic packaging clean space